Title:
リアクタ内でプラチナエッチングを行う方法
Document Type and Number:
Japanese Patent JP5054874
Kind Code:
B2
Abstract:
A reactor for processing semiconductor wafers with electrodes and other surfaces that can be one of heated, textured and/or pre-coated in order to facilitate adherence of materials deposited thereon, and eliminate the disadvantages resulting from the spaulding, flaking and/or delaminating of such materials which can interfere with semiconductor wafer processing.
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Inventors:
Deoneras stephen pee
Jard Leslie Gee
Olson Cart A
Jard Leslie Gee
Olson Cart A
Application Number:
JP2001542603A
Publication Date:
October 24, 2012
Filing Date:
November 21, 2000
Export Citation:
Assignee:
Teagal Corporation
International Classes:
C23C16/46; H01L21/3065; C23C16/44; C23C16/509; H01J37/32; H01L21/00
Domestic Patent References:
| JP9162170A | ||||
| JP2267289A | ||||
| JP4316327A |
Attorney, Agent or Firm:
Minoru Nakamura
Fumiaki Otsuka
Sadao Kumakura
Shishido Kaichi
Hideto Takeuchi
Toshio Imajo
Nobuo Ogawa
Village shrine Atsuo
Takaki Nishijima
Atsushi Hakoda
Fumiaki Otsuka
Sadao Kumakura
Shishido Kaichi
Hideto Takeuchi
Toshio Imajo
Nobuo Ogawa
Village shrine Atsuo
Takaki Nishijima
Atsushi Hakoda