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Title:
基盤を個別にマーキングするための方法
Document Type and Number:
Japanese Patent JP2004501518
Kind Code:
A
Abstract:
A method for individualised marking of electronic components in electronics manufacture, such as circuit boards. On the photosensitive surface required for manufacturing the blanks is exposed, on each blank, a machine-readable pattern, which is subsequently used in the manufacture of the product itself, for individualising the blanks in question.

Inventors:
Launo Salmi
Application Number:
JP2002504532A
Publication Date:
January 15, 2004
Filing Date:
June 21, 2001
Export Citation:
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Assignee:
Launo Salmi
International Classes:
G03F7/20; G03C11/02; H05K1/02; H05K3/00; H01L21/00; H05K3/06; (IPC1-7): H05K3/00; G03F7/20
Domestic Patent References:
JPH0189771U1989-06-13
JPH04359588A1992-12-11
JPH03239552A1991-10-25
JPH10112579A1998-04-28
JPH05206006A1993-08-13
JPS6172216A1986-04-14
JPH10230382A1998-09-02
JPS6454455A1989-03-01
JPH0189771U1989-06-13
JPH04359588A1992-12-11
JPH03239552A1991-10-25
JPH10112579A1998-04-28
JPH05206006A1993-08-13
JPS6172216A1986-04-14
JPH10230382A1998-09-02
JPS6454455A1989-03-01
Attorney, Agent or Firm:
Etsushi Kotani
Kyuichi Ueki
Takao Ito