Title:
基盤を個別にマーキングするための方法
Document Type and Number:
Japanese Patent JP2004501518
Kind Code:
A
Abstract:
A method for individualised marking of electronic components in electronics manufacture, such as circuit boards. On the photosensitive surface required for manufacturing the blanks is exposed, on each blank, a machine-readable pattern, which is subsequently used in the manufacture of the product itself, for individualising the blanks in question.
Inventors:
Launo Salmi
Application Number:
JP2002504532A
Publication Date:
January 15, 2004
Filing Date:
June 21, 2001
Export Citation:
Assignee:
Launo Salmi
International Classes:
G03F7/20; G03C11/02; H05K1/02; H05K3/00; H01L21/00; H05K3/06; (IPC1-7): H05K3/00; G03F7/20
Domestic Patent References:
JPH0189771U | 1989-06-13 | |||
JPH04359588A | 1992-12-11 | |||
JPH03239552A | 1991-10-25 | |||
JPH10112579A | 1998-04-28 | |||
JPH05206006A | 1993-08-13 | |||
JPS6172216A | 1986-04-14 | |||
JPH10230382A | 1998-09-02 | |||
JPS6454455A | 1989-03-01 | |||
JPH0189771U | 1989-06-13 | |||
JPH04359588A | 1992-12-11 | |||
JPH03239552A | 1991-10-25 | |||
JPH10112579A | 1998-04-28 | |||
JPH05206006A | 1993-08-13 | |||
JPS6172216A | 1986-04-14 | |||
JPH10230382A | 1998-09-02 | |||
JPS6454455A | 1989-03-01 |
Attorney, Agent or Firm:
Etsushi Kotani
Kyuichi Ueki
Takao Ito
Kyuichi Ueki
Takao Ito