Title:
HYBRID INTEGRATED CIRCUIT DEVICE AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JP3213579
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To make it possible to perform unitary-body molding by holding the hybrid integrated circuit board having high injection pressure on the first supporting member with a stopper means by engaging the above described hybrid integrated circuit board at the inner side to the side part of the fist supporting member and providing the stopper means in contact with a metal mold at the outside.
SOLUTION: A first supporting member 20 is molded beforehand. A hybrid integrated circuit board is mounted thereon. The first supporting member 20, on which this hybrid integrated circuit board is mounted, is arranged in a metal mold. Molding is performed again with thermoplastic resin. The thermoplastic resin injected at high temperature hits the first supporting member 20. The surface or the hit part begins to be melted. Therefore, the full molding covering the rear surface of the substrate can be performed. Furthermore, by setting contact surface of the first supporting member 20 with the metal mold as the line- or point contact, thus, the interface with injected resin becomes long, e.g. P2, Therefore, moisture resistance can be also improved.
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Inventors:
Noriaki Sakamoto
Application Number:
JP6733298A
Publication Date:
October 02, 2001
Filing Date:
March 17, 1998
Export Citation:
Assignee:
Sanyo Electric Co., Ltd.
International Classes:
H01L23/28; H01L21/56; H05K3/28; (IPC1-7): H01L21/56
Domestic Patent References:
| JP645481A | ||||
| JP5330285A |
Attorney, Agent or Firm:
Masamasa Shibano