Title:
HYBRID INTEGRATED CIRCUIT DEVICE AND MANUFACTUR THEREOF
Document Type and Number:
Japanese Patent JP2630294
Kind Code:
B2
Abstract:
PURPOSE: To realize quite effective noise shield effect by feeding a low or high power supply potential to a conductive sealing resin directly touching at least one of the rear side of a semiconductor chip or the other electrode side of a passive chip device.
CONSTITUTION: Wiring patterns 12, 14 are connected, respectively, with end face electrodes 15 arranged on the circumferential side face of a resin sealed recess 11. In this regard, a multilayer resin sealing structure comprising a nonconductive sealing resin 18 filling the bottom face side and a conductive sealing resin 19 filling the upper part thereof is employed. The conductive sealing resin 19 is applied with any one of low or high power supply potentials and constructed to touch at,least one of the rear side of a semiconductor chip 16 or the other electrode side of passive chip device 17a-17f directly. With such structure, quite effective noise shield effect is provided by the conductive sealing resin 19.
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Inventors:
EGAWA HIDENORI
Application Number:
JP4017595A
Publication Date:
July 16, 1997
Filing Date:
February 28, 1995
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
H05K3/28; H01L25/04; H01L25/18; (IPC1-7): H01L25/04; H01L25/18
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)