To improve a hybrid integrated circuit device in reliability by a method wherein a semiconductor bonded to a heat sink is enhanced in heat dissipating.

A semiconductor 7 is die-bonded to a heat sink 9, the heat sink 9 is mounted on a board 1, the semiconductor 7 is connected to the board 1 with wires 6, the semiconductor 7 is coated with a coating resin 11 where filler that is higher in thermal conductivity than high molecular material is dispersed to be protected, and heat is more dissipated from the surface of the semiconductor 7.