Title:
【発明の名称】高温壁迅速熱処理機
Document Type and Number:
Japanese Patent JP2003507881
Kind Code:
A
Abstract:
An apparatus (10) for heat treatment of a wafer (28) is disclosed. The apparatus includes a heating chamber (18) having a heat source (20). A cooling chamber (32) is positioned adjacent to the heating chamber and includes a cooling source (40). A wafer holder (38) is configured to move between the cooling chamber and the heating chamber through a passageway (54) and one or more shutters (52) defines the size of the passageway. The one or more shutters are movable between an open position where the wafer holder can pass through the passageway and an obstructing position which defines a passageway which is smaller than the passageway defined when the shutter is in the open position.
Inventors:
Latriff Christopher Tea
Kowalski Jeffrey M
Quiu Thai Quinn
Kowalski Jeffrey M
Quiu Thai Quinn
Application Number:
JP2001517110A
Publication Date:
February 25, 2003
Filing Date:
August 11, 2000
Export Citation:
Assignee:
AMS MULS Inc.
International Classes:
F27D3/12; C23C16/455; C23C16/458; C30B25/10; C30B25/14; F27B5/06; F27B5/14; F27D7/02; F27D9/00; H01L21/00; H01L21/205; H01L21/324; F27B5/16; F27D1/18; F27D3/00; (IPC1-7): H01L21/324; F27B5/06; F27B5/14; F27D3/12; F27D7/02; F27D9/00; H01L21/205
Attorney, Agent or Firm:
Minoru Nakamura (9 outside)