PURPOSE: To improve each property evaluated in heat cycle test and improve the crack resistance at dipping in molten solder by sealing a semiconductor element, using an epoxy resin composition which contains at least one of new epoxy resin having special framework structure and new phenol resin.
CONSTITUTION: An epoxy resin composition for sealing a semiconductor element contains at least one of new epoxy resin being the polyglycygil ether being expressed by formulae I and II (n is an integer of 0-300) and new phenol resin being expressed by formulae III and IV (n is an integer of 0-300), and further it comprises an inorganic filler such as silica powder, etc. Since the semiconductor element is sealed with such a special epoxy resin composition, the property evaluated in heat cycle test improves, and the life elongates. Moreover, even in the case of being dipped in molten solder after moisture absorption, package cracks are hard to occur.
NAKAMURA YOSHINOBU
YOSHIDA TSUKASA
DAI ICHI KOGYO SEIYAKU CO LTD