Title:
IC CHIP MOUNTED PAPER AND MANUFACTURING METHOD FOR THE SAME
Document Type and Number:
Japanese Patent JP2012012712
Kind Code:
A
Abstract:
To provide an IC chip mounting paper in which an IC chip is not damaged by using a special calendaring device even when calendared, and further, which has a high smoothness and good printability, and provide a manufacturing method for the IC chip mounting paper.
A manufacturing method for an IC chip mounting paper includes the step of calendaring an IC chip-incorporated paper by passing the paper between a pair of heat rolls between which a predetermined gap is provided.
Inventors:
TSUCHIKAWA KEIICHI
IMAI MASANORI
IMAI MASANORI
Application Number:
JP2010147622A
Publication Date:
January 19, 2012
Filing Date:
June 29, 2010
Export Citation:
Assignee:
TOKUSHU TOKAI SEISHI CO LTD
International Classes:
D21H21/42; G06K19/077
Domestic Patent References:
| JP2005350823A | 2005-12-22 | |||
| JP2009252191A | 2009-10-29 | |||
| JP2007231443A | 2007-09-13 | |||
| JPH07258992A | 1995-10-09 |
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Takashi Watanabe
Suzuki Mitsuyoshi
Kazuya Nishi
Yasuhiko Murayama
Tadashi Takahashi
Takashi Watanabe
Suzuki Mitsuyoshi
Kazuya Nishi
Yasuhiko Murayama