Title:
IC MOUNTING BODY
Document Type and Number:
Japanese Patent JP2003067714
Kind Code:
A
Abstract:
To provide an IC mounting body elongating the serviceable life by preventing corrosion of an antenna constituting an IC module in the IC mounting body.
This IC mounting body is so formed that an IC chip 21 and an inlet holding the antenna 22 electrically connected to the IC chip 21 are stacked on a display substrate 11 via a pressure sensitive adhesive layer 12, the pressure sensitive adhesive layer 12 positioned in the opposite side of a surface side having the inlet and a release paper 13 protecting the pressure sensitive adhesive layer 12 are provided, and the ratio of carboxylic acid containing monomer in the pressure sensitive adhesive layer 12 is 2 mass% or less.
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Inventors:
FUJIKI YASUTAKE
Application Number:
JP2001260338A
Publication Date:
March 07, 2003
Filing Date:
August 29, 2001
Export Citation:
Assignee:
OJI PAPER CO
International Classes:
B42D15/10; C09J201/00; G06K19/07; G06K19/077; G09F3/00; G09F3/10; (IPC1-7): G06K19/077; B42D15/10; C09J201/00; G06K19/07; G09F3/00; G09F3/10
Attorney, Agent or Firm:
Masatake Shiga (6 people outside)