PURPOSE: To facilitate molding process, enhance the high frequency characteristic, allow to curve to a certain direction, prevent from mutual contacting, and assure proper connection by embodying a contact pin in the form of a plate on which a projection is provided in the middle, and implanting to a socket body while inclined a little.

CONSTITUTION: A cover 6 is opened, and an IC element is placed on an upper plate 4a, and leads of the IC are located at the top of a mating contact pin 3. When the cover 6 is closed, the pin 3 is going to protrude. However, if the pin 3 is inclined a little, fitted in a socket body 1, and curved in such a direction as to cause mutual separation when the top is pressed, proper connection with the leads is assured without occurrence of touching even though they are arranged at a very small pitch. The pin 3 has a square or rectangular profile so that the section area can be large even with the same pitch, and the impedance can be small, and the high frequency characteristic when the element is mounted can be enhanced. Also this can be fabricated very easily from a band material through a punch-off process, etc.