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Title:
IMIDE POLYESTER RESIN, THERMOSETTING RESIN COMPOSITION USING THE SAME, AND CURED PRODUCT THEREOF
Document Type and Number:
Japanese Patent JP2001354753
Kind Code:
A
Abstract:

To provide an imide polyester resin which is excellent in surface curability and gives a cured product excellent in resistance to solvents, acids, and heat; a thermosetting resin composition using the same; and a cured product thereof.

This polyester resin is a reaction product of (a) an imide compound having two carboxyl groups and (b) an epoxy compound having two epoxy groups. The thermosetting resin composition essentially comprises (A) the imide-backbone polyester resin, (B) a cross-linker, and (C) a catalyst component.


Inventors:
KOYANAGI TAKAO
YOKOSHIMA MINORU
Application Number:
JP2000181005A
Publication Date:
December 25, 2001
Filing Date:
June 16, 2000
Export Citation:
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Assignee:
NIPPON KAYAKU KK
International Classes:
C08G59/62; H05K3/28; H05K3/46; (IPC1-7): C08G59/62; H05K3/28; H05K3/46
Domestic Patent References:
JPH09194566A1997-07-29
JPS6112721A1986-01-21
JPH10265573A1998-10-06
JPH09268223A1997-10-14
JPH11130859A1999-05-18