IMPEDANCE MATCHING CIRCUIT - MITSUBISHI ELECTRIC CORP

Title:

IMPEDANCE MATCHING CIRCUIT

Document Type and Number:

Japanese Patent JP2016116034

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide an impedance matching circuit which achieves wide-band impedance transformation without causing enlargement of circuit size.SOLUTION: A first line 21 and a second line 22 constituted of the first line 21 having a cubic spiral structure in which wiring is performed over an upper wiring layer and a lower wiring layer possessed by a microwave integrated circuit so that an insulation film of the microwave integrated circuit is located in the center, and the second line 22 having the cubic spiral structure in which wiring in parallel to the first line 21 is performed over the upper wiring layer and the lower wiring layer so that the insulation film is located in the center are electrically connected to each other by a via hole 23.SELECTED DRAWING: Figure 2

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Inventors:

KUWATA EIGO
SAKATA SHUICHI
YAMANAKA KOJI
TSUKAHARA YOSHIHIRO
SUGIMOTO ATSUO
ANDO AKIHIRO

Application Number:

JP2014252124A

Publication Date:

June 23, 2016

Filing Date:

December 12, 2014

Export Citation:

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Assignee:

MITSUBISHI ELECTRIC CORP

International Classes:

H03H7/38; H01F17/00; H01F19/06

Domestic Patent References:

JP2006054207A	2006-02-23
JPH02261209A	1990-10-24
JPH052445U	1993-01-14
JPS6035626U	1985-03-12
JPS60136363A	1985-07-19

Foreign References:

WO2012153691A1

2012-11-15

Attorney, Agent or Firm:

Hideaki Tazawa
Hamada Hatsune
Nakashima Shigeru
Hideo Kawamura
Tatsuya Sakamoto
Tsujioka Masaaki

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