INK COMPOSITION FOR SOLDER RESIST

Japanese Patent JP3288140

B2

PURPOSE: To provide an ink compsn. for solder resist which forms a cured film with high resolving power, excellent resistance to heat and chemicals, strong adhesion and high tackfreeness, prepared by blending a thermosetting resin obtained by effecting a specified reaction of a starting novolac epoxy resin, a photopolymerization initiator and a diluent.
CONSTITUTION: The title compsn. contains (A) a photo-curing resin, (B) a photopolymerization initiator and (C) a diluent. The resin (A) is obtained by introducing an acryloyl group into (a) a novolac epoxy resin with four or more nuclei by reaction with (b) a (meth)acrylic acid and (c) a polyfunctional (meth)acrylate having one carboxy1 group and two or more (meth)acryloy1 groups, to introduce an acryloyl group by the reaction of the carboxyl groups of components (b) and (c) with the epoxy group of component (a) and increasing the molecular weight of the reaction product by use of (d) a chain extender with two or more functional groups capable of reacting with OH group and/or epoxy group via the OH group and/or epoxy group of component (a).

JPH1052908	RECORDING MEDIUM AND RECORDING METHOD USING THE RECORDING MEDIUM
JPS583503	[Title of the Invention] Tie Netsyameyouzai varnish Nose Elephant Hohou
JP2020140065	CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT AND ELECTRONIC COMPONENT

Toshio Awaji
Nobuaki Ohtsuki
Motohiro Arakawa

JP17678793A

June 04, 2002

July 16, 1993

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Nippon Shokubai Co., Ltd.

C08F290/00; C08F299/02; C08G59/14; C08L63/10; C08F290/14; G03F7/027; G03F7/038; H05K3/28; (IPC1-7): C08G59/14; C08F299/02; G03F7/027; G03F7/038

JP693221A
JP5179185A
JP63205650A
JP693082A
JP5230158A
JP736183A
JP578449A
JP1141908A
JP4728081A

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