Title:
INSPECTION DEVICE
Document Type and Number:
Japanese Patent JP2018054433
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To suppress increase in the temperature of a semiconductor device when a current is flown in the semiconductor device momentarily.SOLUTION: The inspection device for a semiconductor device includes: a stage on which the semiconductor device is to be mounted; a probe pin in contact with the surface of the semiconductor device; and an energization device which flows a current in the semiconductor device through the stage and the probe pin, at least one of the stage and the probe pin having a semiconductor member. The semiconductor device forms a part of the current path of the energization device, and the inspection device absorbs heat from the semiconductor device by Peltier effect when a current is flown in the semiconductor device.SELECTED DRAWING: Figure 3
Inventors:
SUGIMOTO MASAHIRO
AOI SACHIKO
URAGAMI YASUSHI
AOI SACHIKO
URAGAMI YASUSHI
Application Number:
JP2016190025A
Publication Date:
April 05, 2018
Filing Date:
September 28, 2016
Export Citation:
Assignee:
TOYOTA MOTOR CORP
International Classes:
G01R31/26
Domestic Patent References:
| JPH10160785A | 1998-06-19 | |||
| JPS5199482A | 1976-09-02 | |||
| JPH03131737A | 1991-06-05 | |||
| JP2008281466A | 2008-11-20 | |||
| JPH0722549A | 1995-01-24 | |||
| JPH0831992A | 1996-02-02 |
Foreign References:
| US20130043875A1 | 2013-02-21 | |||
| US20060101829A1 | 2006-05-18 |
Attorney, Agent or Firm:
Kaiyu International Patent Office