To improve insulating properties for a small film thickness by providing a first layer consisting of molecules immobilized by the transition metal- sulfur bond the or chelate bond such as shown by formula, to the surface of a conductor consisting of the transition metal, and a second layer of a resin bonded by a covalent linkage with the molecule of the first layer, formed on the first layer.
A first layer consisting of a molecule immobilized by the bonding of a transition metal and sulfur as shown by formula I, or by a chelate bond selected from among linkages as shown by formula II, is formed on the surface of a conductor consisting of the transition metal. Further, a second layer consisting of a resin bonded by a covalent linkage with the molecule of the first layer, is formed on the first layer. (S in sulfur and M is the transition metal). A chemical compound with a functional group which can form the chelate bond is capable of coordinating securely in the metal as an anchor compound. The manufacturing process is to immobilize the anchor compound in high density on the surface of a base and then link the resin to the surface of the compound through the covalent linkage and further, apply the precursor of the resin to the surface of the base to thermally resinify the precursor.
OTAKE TADASHI
MINO NORIHISA
TAKEZAWA HIROTERU
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