Title:
絶縁樹脂シート及びこれを備えたプリント回路基板
Document Type and Number:
Japanese Patent JP7019900
Kind Code:
B2
Abstract:
The present invention provides an insulating resin sheet and a printed circuit board using the insulating resin sheet. The printed circuit board according to the embodiment of the present invention includes an insulating resin layer including a first insulating resin and a filler, an adhesive auxiliary layer laminated on the insulating resin layer and including a second insulating resin containing a photosensitive material; and a circuit pattern bonded to the adhesive auxiliary layer.
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Inventors:
Jacques Lee
Seor-Archon
Hawa-Yun Lee
Ho-Hyun Ham
Ok-Seon Yun
Seor-Archon
Hawa-Yun Lee
Ho-Hyun Ham
Ok-Seon Yun
Application Number:
JP2016204252A
Publication Date:
February 16, 2022
Filing Date:
October 18, 2016
Export Citation:
Assignee:
Samsung Electro-Mechanics Company Limited.
International Classes:
H05K3/38; B32B15/08; H05K1/03
Domestic Patent References:
| JP2015188073A | ||||
| JP6268380A | ||||
| JP711449A | ||||
| JP2015164160A |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation