To solve the following problem that it is difficult to form a complex hollow for mounting an MMIC 202 on an expensive multilayer ceramic substrate and to manufacture a large substrate in a conventional integrated circuit for microwaves.
In a multilayer substrate 101, a dielectric containing Teflon (registered trademark) is stuck onto a first layer substrate 101a, a dielectric made of glass and epoxy is stuck onto a second layer substrate 101b and a third layer substrate 101c, and a through hole for function module mounting is provided. In a power amplifier function module 102, a power amplifier MMIC, an isolator 203 and an input-output line substrate 204 are arranged on a metal carrier 201 with conductive materials 209, and wires 207 are used to connect a signal line, a power supply line and a control line of each component. A ground electrode arranged on a lower surface of the input-output line substrate 204 is connected to a ground electrode on the multilayer substrate 101 with a thermoplastic adhesive 208 to make a connection distance between the function module and the multilayer substrate 101 short.
TAKAHASHI KAZUAKI
OGURA HIROSHI
HIRANO YOSHITERU
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