Title:
界面材料ならびにその製造法および使用
Document Type and Number:
Japanese Patent JP2004533705
Kind Code:
A
Abstract:
An interface material for electronic devices comprising at least one resin material and at least one solder material comprising indium, silver, copper, aluminum, tin, bismuth, gallium and alloys thereof, silver-coated copper, silver-coated aluminum.
Inventors:
Nguyen, Me
Application Number:
JP2002588564A
Publication Date:
November 04, 2004
Filing Date:
May 07, 2002
Export Citation:
Assignee:
Honeywell International Inc.
International Classes:
H01B1/22; B23K1/00; B23K1/20; B23K35/02; C08F279/00; C08F279/02; C08J5/18; C08K3/00; C08K3/08; C08K9/02; C08L13/00; C08L15/00; C08L51/04; H01B13/00; H01L23/373; B23K35/26; B23K35/36; (IPC1-7): H01B1/22; H01B13/00
Domestic Patent References:
| JPH07207160A | 1995-08-08 | |||
| JPS6293810A | 1987-04-30 | |||
| JP2002322363A | 2002-11-08 | |||
| JPH0484444A | 1992-03-17 | |||
| JPS5713427A | 1982-01-23 | |||
| JP2004526822A | 2004-09-02 |
Foreign References:
| US5837119A | 1998-11-17 |
Attorney, Agent or Firm:
Yoshio Kawaguchi
Akio Ichiiri
Makoto Ono
Katsuma Osaki
Mitsuaki Tsubokura
Akio Ichiiri
Makoto Ono
Katsuma Osaki
Mitsuaki Tsubokura