Title:
INTERLAYER INSULATING FILM, ITS FORMING METHOD, AND POLYMER COMPOSITION
Document Type and Number:
Japanese Patent JP3916532
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an interlayer insulating film which is low in dielectric constant and hygroscopic property and which at the same time is superior in mechanical strengths.
SOLUTION: The interlayer insulating film comprises a polymer in which a first monomer which has a substituted acetylenyl group and is polymerizable to three-dimensional directions, e.g. an adamantane derivative having a substituted acetylenyl group, and a second monomer which has a substituted cyclopentanonyl group and is polymerizable to two-dimensional directions, e.g. an aromatic derivative having a substituted cyclopentanonyl group are polymerized three-dimensionally.
Inventors:
Nobuo Aoi
Application Number:
JP2002229013A
Publication Date:
May 16, 2007
Filing Date:
August 06, 2002
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
C08F238/02; C08G61/02; C08F232/06; C09D4/00; H01L21/312; H01L21/768; H01L23/522; (IPC1-7): C08F238/02; C08F232/06; H01L21/312; H01L21/768
Attorney, Agent or Firm:
Hiroshi Maeda
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Atsushi Fujita
Kazunari Ninomiya
Tomoo Harada
Iseki Katsumori
Seki Kei
Yasuya Sugiura
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Atsushi Fujita
Kazunari Ninomiya
Tomoo Harada
Iseki Katsumori
Seki Kei
Yasuya Sugiura