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Patent Searching and Data


Title:
INTERLAYER INSULATING FILM, ITS FORMING METHOD, AND POLYMER COMPOSITION
Document Type and Number:
Japanese Patent JP3916532
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide an interlayer insulating film which is low in dielectric constant and hygroscopic property and which at the same time is superior in mechanical strengths.
SOLUTION: The interlayer insulating film comprises a polymer in which a first monomer which has a substituted acetylenyl group and is polymerizable to three-dimensional directions, e.g. an adamantane derivative having a substituted acetylenyl group, and a second monomer which has a substituted cyclopentanonyl group and is polymerizable to two-dimensional directions, e.g. an aromatic derivative having a substituted cyclopentanonyl group are polymerized three-dimensionally.


Inventors:
Nobuo Aoi
Application Number:
JP2002229013A
Publication Date:
May 16, 2007
Filing Date:
August 06, 2002
Export Citation:
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Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
C08F238/02; C08G61/02; C08F232/06; C09D4/00; H01L21/312; H01L21/768; H01L23/522; (IPC1-7): C08F238/02; C08F232/06; H01L21/312; H01L21/768
Attorney, Agent or Firm:
Hiroshi Maeda
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Atsushi Fujita
Kazunari Ninomiya
Tomoo Harada
Iseki Katsumori
Seki Kei
Yasuya Sugiura