Title:
INTERLAYER INSULATING MATERIAL FILM FOR PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD USING IT
Document Type and Number:
Japanese Patent JP2002252470
Kind Code:
A
Abstract:
To provide an interlayer insulating material film for a printed wiring film and a multilayer printed wiring board wherein both an embedding characteristic of a via hole and/or through hole and the peel strength of a conductive layer are provided.
The interlayer insulating material film for the printed wiring board comprises at least a support base film 3, an insulating resin layer 2 which is, being solid at a normal temperature, laminated on its surface, and a protecting film 1. At laminating, only the support base film is peeled so as to bond to an inner-layer circuit substrate by a resin surface to which the support base film is contacted.
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Inventors:
ENDO MITSUTERU
KAWAMOTO KENJI
CHINO MASAAKI
KAWAMOTO KENJI
CHINO MASAAKI
Application Number:
JP2001049853A
Publication Date:
September 06, 2002
Filing Date:
February 26, 2001
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD
International Classes:
C08J7/00; C08K3/00; C08L63/00; C08L71/12; C08L79/08; C08L81/06; H05K3/46; (IPC1-7): H05K3/46; C08J7/00; C08K3/00; C08L63/00; C08L71/12; C08L79/08; C08L81/06
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