Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
JOINTING STRUCTURE AND BONDING PROCESS OF WOODY SYSTEM MATERIAL
Document Type and Number:
Japanese Patent JP2009132086
Kind Code:
A
Abstract:

To provide a jointing structure and the bonding process of a woody system material having a strong adhesive strength and excellent dimension stability in an adhesive bondage of a woody system material with a PEG type adhesive agent at a low cost and further, as a result, to be capable of manufacturing a novel woody board from a periodic thinning, etc. at a commercial scale.

The process of a woody board includes (1) the process of a woody element from a woody material, (2) the process of subjecting the woody element to ozone treatment, (3) the process of coating an adhesive agent (PEG type adhesive agent) containing polyethylene glycol as a main ingredient to the ozone-treated woody element, and (4) the process of forming the woody element obtained in the above process (3), followed by pressing under heating.


Inventors:
KOMA HIDEAKI
TSUNODA ATSUSHI
TANAKA KEIJI
YASUDA OSAMU
Application Number:
JP2007311198A
Publication Date:
June 18, 2009
Filing Date:
November 30, 2007
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FORESTRY & FOREST PRODUCTS RES
SHINWA MOKUZAI KOGYO KK
International Classes:
B27N3/00; B27N3/18; B32B21/08; C09J109/08; C09J125/10; C09J171/02
Attorney, Agent or Firm:
Koichi Ouchi