Kinck formation outside a substrate of a bond wire

Title:

Kinck formation outside a substrate of a bond wire

Document Type and Number:

Japanese Patent JP6073529

Kind Code:

B2

Abstract:

An electrically conductive lead is formed using a bonding tool. After bonding the wire to a metal surface and extending a length of the wire beyond the bonding tool, the wire is clamped. Movement of the bonding tool imparts a kink to the wire at a location where the wire is fully separated from any metal element other than the bonding tool. A forming element, e.g., an edge or a blade skirt provided at an exterior surface of the bonding tool can help kink the wire. Optionally, twisting the wire while tensioning the wire using the bonding tool can cause the wire to break and define an end. The lead then extends from the metal surface to the end, and may exhibit a sign of the torsional force applied thereto.

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JP3164341	BUMP FOR SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
JPS63114223	MANUFACTURE OF CONNECTION TERMINAL
JPH04302153	BONDING STRUCTURE OF SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

Inventors:

Haba Bergasem
Corinaldo
Saga Shizuku Rizzary
Zoni Wael

Application Number:

JP2016530188A

Publication Date:

February 01, 2017

Filing Date:

November 11, 2014

Export Citation:

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Assignee:

Inventus Corporation

International Classes:

H01L21/60; H01L21/56; H01L25/065; H01L25/07; H01L25/18

Domestic Patent References:

JP2007066991A
JP2001118876A

Foreign References:

WO2013126269A1
US20010020545

Attorney, Agent or Firm:

Takaki Nishijima
Disciple Maru Ken
Shinichiro Tanaka
Ino Sato
Mitsuru Matsushita
Ichiro Kurasawa
Katsuomi Isogai

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