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Title:
LAID FLOOR SURFACE MATERIAL AND FLOOR STRUCTURE
Document Type and Number:
Japanese Patent JP2006283550
Kind Code:
A
Abstract:

To provide a laid floor surface material excellent in stability and durability in a formed floor surface, in the laid floor surface material constructible and removable without damaging an existing floor surface and a floor backing of a building.

This laid floor surface material is placed on the existing floor surface or the floor backing of the building, and has a base material having the thickness of 3 mm or less and a floor surface material joined on this base material. The laid floor surface material is formed by joining the base material and the floor surface material so that average adhesive strength measured by a predetermined method becomes 0.5 N or more.


Inventors:
INOGUCHI YUKIO
Application Number:
JP2006059667A
Publication Date:
October 19, 2006
Filing Date:
March 06, 2006
Export Citation:
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Assignee:
MITSUBISHI KAGAKU SANSHI CORP
International Classes:
E04F15/00; E04F15/18
Domestic Patent References:
JPH0530335U1993-04-20
JPH035562A1991-01-11
JP2003138239A2003-05-14
JP2004019123A2004-01-22
Attorney, Agent or Firm:
Tsuyoshi Shigeno



 
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