To provide a laminated body which keeps sufficient adhesion force acquired between a polyimide layer and a conductor layer after circuit forming and the fall of adhesion force is made not to arise after thermal loading, and which can be used for a flexible circuit board or the like.

The laminated body comprises a silicon layer with silicon or a silicon compound overlying the surface of a base film consisting of, for example, a polymer resin such as a polyimide film or the like, and further at least a metal layer overlying the surface of the silicon layer, and a copper electrically conductive layer on the surface of the metal layer sequentially.