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Patent Searching and Data


Title:
LAMINATED COPPER PLATE AND COPPER PLATE COATING MATERIAL USED THEREFOR
Document Type and Number:
Japanese Patent JPH07117169
Kind Code:
A
Abstract:

PURPOSE: To obtain a laminated copper plate, preventing the surface of copper plate from being scratched or contaminated and easy to remove a coating layer, by a method wherein the coating layer, consisting of a coating material made up mainly of water-soluble polymerized compound provided with a specified chemical structure, is formed on the surface of the copper plate.

CONSTITUTION: A coating layer, consisting of a coating material made up mainly of water-soluble polymerized compound constituted of a repeating unit shown by a formula, is formed on the surface of a copper plate easy to prevent scratch or contamination against the surface of the copper plate or to coat it, so that removal of a formed coating film can be effected simply. In the formula, A is a unit constituted of the repeating of (CH2CH2O) and (CH2R1.CHO), R1 is hydrocarbon group, X is the residue of organic compound having two active hydrogen groups and R2 is the residue of dicarboxylic acid compound group or the residue of di-isocyanate compound.


Inventors:
MATSUO KATSUAKI
ISODA CHUZO
FUJIWARA TSUYOSHI
Application Number:
JP26393293A
Publication Date:
May 09, 1995
Filing Date:
October 21, 1993
Export Citation:
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Assignee:
DAI ICHI KOGYO SEIYAKU CO LTD
International Classes:
E04D1/28; B32B15/08; B32B15/12; (IPC1-7): B32B15/08; B32B15/12
Attorney, Agent or Firm:
Nishihiko Yasuhiko