Title:
LAMINATED FILM
Document Type and Number:
Japanese Patent JP2014004807
Kind Code:
A
Abstract:
To provide a laminated film capable of being favorably used in formation of an electrode metal for use in an electronic device and the like and easily forming a metal layer to be an electrode in a circuit board by a transfer method.
The laminated film includes: a resin film (A) containing polyester as a main component; a carbon layer (B) containing a carbon element as a main component; and a metal layer containing a copper element as a main component laminated in this order, and the carbon layer (B) has a surface electric resistance of 1 MΩ/sq or more.
Inventors:
TANI SATORU
KOTOURA MASAAKI
FUKUSHIMA KAZUHIRO
KOTOURA MASAAKI
FUKUSHIMA KAZUHIRO
Application Number:
JP2012143920A
Publication Date:
January 16, 2014
Filing Date:
June 27, 2012
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
B32B15/04; B32B18/00; H05K3/20