Title:
LAMINATED SHEET FOR PRINTED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2659490
Kind Code:
B2
Abstract:
PURPOSE: To ensure the safety by especially enhancing tracking resistance without deteriorating electric characteristics by forming the surface layer of a laminated sheet for a printed circuit board from a specific thermosetting resin glass fabric and forming an intermediate layer from a specific thermosetting resin nonwoven fabric.
CONSTITUTION: In a laminated sheet for a printed circuit board used in electric machinery, the surface layer thereof is formed from a thermosetting resin glass fabric containing an inorg. filler in an amount of 10-200% by wt. of the resin of the surface layer and the intermediate layer thereof is formed from a thermosetting resin nonwoven fabric containing an inorg. filler in an amount of 10-200% by wt. of the resin of the intermediate layer. By this constitution, tracking resistance is especially enhanced without deteriorating the electrical characteristics or other various characteristics of the laminated sheet for the printed circuit board to ensure the safety.
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Inventors:
NAKADA TAKAHIRO
Application Number:
JP6468392A
Publication Date:
September 30, 1997
Filing Date:
March 23, 1992
Export Citation:
Assignee:
SUMITOMO BEEKURAITO KK
International Classes:
B32B27/00; B32B17/02; B32B17/04; B32B27/02; B32B27/20; H05K1/03; (IPC1-7): B32B27/02; B32B17/02; B32B17/04; B32B27/00; B32B27/20; H05K1/03
Domestic Patent References:
| JPS60203438A | ||||
| JPS55124656A |