To provide a remedial technique for effectively dealing with a condensate generated in a joint between layer constituent members, when a plurality of the layer constituent members are to be lapped over each other.
An embossed pattern 2 is formed on a protecting film 1 to be used, in a lapping fashion, on FPC 10, so that the surface of the FPC 10 is protected. In this way, numerous gaps 3 which do not come into contact with the FPC 10 are formed, when a laminated structure is constituted by lapping the protecting film 1 over the FPC 10. These gaps 3 communicate with each other and at the same time, communicate with the open air. Consequently, a condensate generated on the FPC 10 in the joint is turned loose (evaporated) to the outside, passing through the gaps 3. Thus the condensate is prevented from remaining on the surface of the FPC 10. Besides, the condensate generated on the protecting film 1 is prevented from sticking to the FPC 10.
HIDAKA MICHINOBU
TSURUOKA YASURO
NAGURA MASAYUKI
KOTANI AKIRA
TIBC KK
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