To provide a laminated workpiece segmentation system and a laminated workpiece segmentation method capable of continuously cutting out thin workpieces one by one with a predetermined pressing force from a laminated workpiece with a sticking force being reduced by separation enhancement to smoothly convey the thin workpieces.
A laminated workpiece segmentation system comprises: a separation tank 20 which enhances the separation of a laminated workpiece; a segmentation device 30 in which a segmentation conveyor cuts out an uppermost workpiece of the laminated workpiece while enhancing the separation of the laminated workpiece; a multiple workpiece feeding prevention device 40 which prevents the passage of two or more workpieces; a workpiece vibration conveying device 50 which chips a cracked corner portion by conveying the workpiece while vibrating it; a chipped workpiece identification device 60 which detects the chipped corner portion of the workpiece being conveyed; a workpiece sorting device 70 which passes a non-defective workpiece to the downstream side and collects the chipped workpiece; and a workpiece housing device 80 which houses the non-defective workpiece. This invention also provides a laminated workpiece segmentation method using this system.
SUGISHITA HIROSHI
AMI MASAAKI
NIKI MASAYUKI
SAITOU SEIKI CO LTD