Title:
積層体および物品
Document Type and Number:
Japanese Patent JP7405166
Kind Code:
B2
Abstract:
To provide a laminate used in an overlay method and capable of suppressing generation of unevenness defect.SOLUTION: There is provided a laminate used in an overlay method, having a resin substrate layer and an adhesive layer arranged on one surface side of the resin substrate layer and containing an adhesive, and having a temperature at an inflection point in a gain side of P1, wherein P1 is a peak at glass transition point of the adhesive in a graph by measuring logarithmic decrement of the adhesive by a rigid body pendulum method and plotting the logarithmic decrement against a measured temperature, of 120°C to 160°C.SELECTED DRAWING: Figure 2
Inventors:
Hiroshi Kishimoto
Application Number:
JP2022015410A
Publication Date:
December 26, 2023
Filing Date:
February 03, 2022
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
B32B27/40; B32B27/00; B32B27/30; C08G71/04; C09J7/30
Domestic Patent References:
| JP10067840A | ||||
| JP2005146025A | ||||
| JP2017066233A | ||||
| JP6316045A | ||||
| JP2009173011A | ||||
| JP8109271A | ||||
| JP2006272586A | ||||
| JP2006205421A |
Foreign References:
| WO2017145479A1 |
Attorney, Agent or Firm:
Akihiko Yamashita
Tatsuto Kishimoto
Tatsuto Kishimoto
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