Title:
LASER ASSISTED BENDING METHOD AND DEVICE THEREFOR
Document Type and Number:
Japanese Patent JP3295109
Kind Code:
B2
Abstract:
PURPOSE: To easily bend material to be worked with good bending accuracy by irradiating a bending part of the material to be worked with heating beam, heating it, then, bending it with a bending machine.
CONSTITUTION: A laser beam LB oscillated by a laser oscillator is reflected with a parabolic mirror 103, condensed into a condenser lens 105, irradiates the front or rear side of the material W to be worked through the hole of the laser working head body 97 and heats it. The material W to be worked is mounted on a bottom die 55, a top die 57 is lowered and the material W to be worked is pressed and fixed by the bottom die 55 and the top die 57. When a die holder 67 is oscillated in the lower direction or in the upper direction under this state, the material W to be worked is bent by an upper bending die 69 or a lower bending die 71 in the lower direction or in the upper direction.
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Inventors:
Takeji Arai
Toshihide Kato
Hiroshi Mitsuhashi
Toshihide Kato
Hiroshi Mitsuhashi
Application Number:
JP25553891A
Publication Date:
June 24, 2002
Filing Date:
October 02, 1991
Export Citation:
Assignee:
Amada Co., Ltd.
International Classes:
B21D5/01; B21D5/02; B21D5/04; B21D11/22; B23K10/00; B23K15/00; (IPC1-7): B21D5/04; B21D11/22
Domestic Patent References:
| JP3215019A | ||||
| JP4220118A |
Attorney, Agent or Firm:
Hidekazu Miyoshi