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Patent Searching and Data


Title:
LASER CONTROL DEVICE AND SCRAP MATERIAL PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2004291080
Kind Code:
A
Abstract:

To provide a laser control device and a scrap material processing method in which an operator can perform cutting by merely indicating instruction points without preparing a program.

The laser control device is equipped with: an axis moving means for moving a laser head; an inputting means for instructing a height control starting position and its completing position at an arbitrary coordinate position moved by the axis moving means; a shift distance storage section in which a preset shift distance is stored; an automatic arithmetic means for calculating the processing starting and completing positions that are assumed at a position the shift-distance away from the height control starting position and completing position; and an automatic processing operating means for preparing the cutting processing program on the basis of the processing starting and completing positions calculated by the automatic arithmetic means and the height control starting position and completing position.


Inventors:
KIN SOJO
USAMI TSUTOMU
TAKADA HIROKO
Application Number:
JP2003090583A
Publication Date:
October 21, 2004
Filing Date:
March 28, 2003
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B23K26/38; B23K26/046; B23K26/082; (IPC1-7): B23K26/00; B23K26/04; B23K26/08
Attorney, Agent or Firm:
Kaneo Miyata
Yahei Takase