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Title:
レーザ加工ヘッド
Document Type and Number:
Japanese Patent JP6881199
Kind Code:
B2
Abstract:
To provide a laser processing head that is miniaturized by shortening a length of an optical path.SOLUTION: A laser processing head 1 provided to a laser processing machine includes: a housing 10; a scanning part 50; an optical member 40; a transparent member 60; and a light shielding member 80 for covering a peripheral part S2 while exposing an irradiation region S1 of the transparent member 60. The optical member 40 is provided in a position upstream from the light shielding member 80 in an irradiation direction and overlapping on the light shielding member 80 and the transparent member 60 in the irradiation direction.SELECTED DRAWING: Figure 4

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Inventors:
Kazuhiro Nakajima
Kosuke Gota
Application Number:
JP2017189936A
Publication Date:
June 02, 2021
Filing Date:
September 29, 2017
Export Citation:
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Assignee:
Brother Industries, Ltd.
International Classes:
B23K26/082; B23K26/066; G02B26/10
Domestic Patent References:
JP2013071136A
Attorney, Agent or Firm:
Patent business corporation NEXT



 
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