Title:
レーザ加工装置及びレーザ加工方法
Document Type and Number:
Japanese Patent JP7421951
Kind Code:
B2
Abstract:
A laser processing apparatus 1A includes a semiconductor laser element 2, a waveform output unit 6 for outputting input waveform data Da, a driver circuit 4 for supplying a drive current id having a time waveform according to the input waveform data Da to the semiconductor laser element 2, and a processing optical system 5 for irradiating a processing object B with laser light output from the semiconductor laser element 2. The semiconductor laser element 2 outputs the laser light in which two or more light pulse groups each including one or a plurality of light pulses are provided with a time interval therebetween. Time waveforms of at least two light pulse groups out of the two or more light pulse groups are different from each other. The time waveform includes at least one of a time waveform of each of the one or plurality of light pulses, a time width of each of the one or plurality of light pulses, and a time interval of the plurality of light pulses. Thus, it is possible to realize a laser processing apparatus and a laser processing method capable of reducing a size of a configuration in which a processing object is irradiated with a plurality of light pulses having different time waveforms with a time difference.
Inventors:
Takashi Kurita
Kazuki Kawai
Kazuki Kawai
Application Number:
JP2020030762A
Publication Date:
January 25, 2024
Filing Date:
February 26, 2020
Export Citation:
Assignee:
Hamamatsu Photonics K.K.
International Classes:
H01S5/06; B23K26/0622; H01S3/00
Domestic Patent References:
| JP2015503856A | ||||
| JP2010082672A | ||||
| JP2017064747A | ||||
| JP2015037808A | ||||
| JP2006263754A |
Foreign References:
| WO2018110222A1 | ||||
| WO2018105082A1 | ||||
| US20150336208 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Kenichi Shibayama
Shotaro Terazawa
Yoshiki Kuroki
Kenichi Shibayama
Shotaro Terazawa