To provide the method for processing a light permeable member, which flexibly responds to production requirements on demand, while avoiding the buildup of waste liquid caused by the photo lithography method, and moreover can prevent light permeability of the light permeable member from being deteriorated due to production of bubbles and luminescent spots, etc.

A transparent substrate 100, which is a light permeable member, is processed with a laser processing device in the following way: after an target area to be processed of the transparent substrate 100 is irradiated by a weak laser beam which is as weak as the substrate is not deformed, it is irradiated with a strong laser beam which is stronger than the former beam and an electro-conductive layer of the surface of the substrate is partially eliminated. This method can effectively inhibit bubbles produced in the base material layer which is a bottom portion of the electro-conductive layer, and restrain luminescent spots generated in the layer lying between the electro-conductive layer and the base material layer.