Title:
ディップ成形用ラテックス組成物及びこれから製造されたディップ成形品
Document Type and Number:
Japanese Patent JP6458139
Kind Code:
B2
Abstract:
Provided is a latex composition for dip forming which includes 100 parts by weight of a nitrile-based hybrid latex including a first latex and a second latex which have different glass transition temperatures, and 2 parts by weight to 8 parts by weight of an ion-conductive polymer having a weight-average molecular weight of 400 to 1,000. The latex composition for dip forming has excellent low-temperature stability and a dip-formed article prepared using the composition has excellent tensile strength and elongation. Since wearing comfort is improved due to a decrease in modulus, the dip-formed article may be suitable for industries requiring such properties.
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Inventors:
Cho, Won-te
Kim, Hyun-woo
Yo Seung-Wook
Yang, Seung-Hun
Kim, Ji-hyun
Kim, Hyun-woo
Yo Seung-Wook
Yang, Seung-Hun
Kim, Ji-hyun
Application Number:
JP2017516740A
Publication Date:
January 23, 2019
Filing Date:
December 23, 2015
Export Citation:
Assignee:
LG HAUSYS,LTD.
International Classes:
C08L9/04; A41D19/00; A41D19/04; B29C41/14; C08F2/24; C08F236/12; C08J3/02; C08L13/02; C08L71/02; C08L101/12
Domestic Patent References:
| JP2003277523A | ||||
| JP2014530289A | ||||
| JP2003165814A | ||||
| JP11092595A | ||||
| JP2017532406A |
Foreign References:
| WO2011115093A1 | ||||
| WO2014034889A1 | ||||
| WO2014142424A1 | ||||
| EP0594410A1 |
Attorney, Agent or Firm:
Ikeuchi, Sato & Partners