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Patent Searching and Data


Title:
LEAD FRAME FOR SEMICONDUCTOR CHIP
Document Type and Number:
Japanese Patent JPH0669401
Kind Code:
A
Abstract:

PURPOSE: To prevent inclusion of bubbles in a molding resin for encapsulation by providing a hole for resin reservoir in the part opposed to the frame body which constitutes a gate for molten resin.

CONSTITUTION: A resin reservoir 9 is provided. The location is in a frame body 2 portion in the longitudinal direction of a lead frame 1 and at a resin injection part 10 or a position opposed to a gate 12. Since the hole 9 for resin reservoir is formed, bubbles are also made to flow into the hole 9 for resin reservoir through an air vent portion located between a cavity and the frame body 2, along with molten resin injected from the resin injection port or gate 10. This allows the bubbles in the cavity to flow and, in addition, prevents the molten resin from flowing out of the lead frame 1, and the bubbles can be removed while preventing the formation of thick burrs.


Inventors:
MARUYAMA YUTAKA
Application Number:
JP21804992A
Publication Date:
March 11, 1994
Filing Date:
August 18, 1992
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
H01L21/56; H01L23/28; H01L23/50; (IPC1-7): H01L23/50; H01L21/56; H01L23/28
Attorney, Agent or Firm:
Norio Ogo