PURPOSE: To prevent creeping-up of a brazing material onto a hanging lead and to enhance reliability by providing a brazing material reservoir for reserving flowing brazing material when the material overflows on the lead so as to bring a chip into close contact with a die pad.

CONSTITUTION: A brazing material 8 is placed on a die pad 3 to heat the pad 3 to a high temperature thereby to melt the material 8. A chip 5 is placed on the material 8 in this state, and brought into close contact with the pad 3. In this case, since the chip 5 is formed in a shape for pressing the material 8 from above, the material 8 is extended from the chip 5 to flow on the pad 3, the material 8 flows to a brazing material reservoir 9 becoming a further higher temperature on a hanging lead 4, and the material 8 reserved in the reservoir 9 is stopped thereby. Then, bonding pads 6, inner leads 2 or the leads 4 on the chip 5 are wire bonded by wiring 7.