Title:
リフトオフ方法
Document Type and Number:
Japanese Patent JP7206109
Kind Code:
B2
Abstract:
To provide a lift-off method which enables the reduction of damage which would be given to a moving member when moving an optical device layer.SOLUTION: A lift-off method comprises: a transfer-target substrate-bonding step of bonding a transfer-target substrate 130 to a surface of an optical device layer 104 of an optical device wafer 100 through a bonding layer 120 containing a light-absorbing material operable to absorb a wavelength of a pulse laser beam 300 to form a composite substrate 200; a buffer layer-destroying step of applying a pulse laser beam 300 of a wavelength which has a transmitting property to an epitaxial substrate 101 and a property of being absorbed by a buffer layer 103 from the side of a rear face 109 of an epitaxial substrate 101 of the optical device wafer 100 which constitutes the composite substrate 200, thereby destroying the buffer layer 103; and an optical device layer-transferring step of peeling the epitaxial substrate 101 from the optical device layer 104 to transfer the optical device layer 104 to the transfer-target substrate 130.SELECTED DRAWING: Figure 7
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Inventors:
Zhang Zhong Shun
Application Number:
JP2018247574A
Publication Date:
January 17, 2023
Filing Date:
December 28, 2018
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L33/02; H01L33/32
Domestic Patent References:
| JP2011124311A | ||||
| JP2004072052A | ||||
| JP2015149330A | ||||
| JP2007525016A | ||||
| JP10125931A | ||||
| JP2002368282A | ||||
| JP200773995A |
Foreign References:
| US20110215352 |
Attorney, Agent or Firm:
Sakai International Patent Office
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