Title:
ELECTROLESS GOLD PLATING BATH AND ELECTROLESS GOLD PLATING METHOD
Document Type and Number:
Japanese Patent JP3175562
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain non-reddish, good appearance at the time of thick forming of a gold plating film by adding acid amide and acid imide compd. into an electroless gold plating bath.
SOLUTION: The acid amide and acid imide compd. are added into the electroless gold plating bath contg. a gold raw material and a complexing agent. A material to be plated is immersed into this plating bath and is subjected to electroless gold plating, by which the thick forming of the gold plating film is executed. The acid amide and acid imide compd. are added to this electroless strike gold plating bath in the case electroless strike gold plating is executed. The concn. of the gold in the plating bath is preferably about 0.5 to 10g/l. The complexing agent is usually compounded at about 5 to 300g/l. Formamide, dimethyl formamide, etc., are usually used for the acid amide and succinic imide, glutarimide, etc., are used for the axis imide. The compounding rate thereof is usually preferably in a range of 0.1 to 50g/l. This plating bath is used usually in a range of pH 3.5 to 9.
Inventors:
Hiroki Uchida
Toru Kamitamari
Koichiro Shimizu
Toru Kamitamari
Koichiro Shimizu
Application Number:
JP29918795A
Publication Date:
June 11, 2001
Filing Date:
October 23, 1995
Export Citation:
Assignee:
Uemura Industry Co., Ltd.
International Classes:
C23C18/42; C23C18/44; C23C18/52; H05K3/24; (IPC1-7): C23C18/44; H05K3/24
Domestic Patent References:
| JP3193882A |
Attorney, Agent or Firm:
Takashi Kojima
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