Title:
LIGHTWEIGHT CIRCUIT BOARD WITH CONDUCTIVITY CONSTRAINING CORE
Document Type and Number:
Japanese Patent JP2009164582
Kind Code:
A
Abstract:
To provide prepregs, laminates, printed wiring board structures and materials and printed wiring boards that make it possible to construct printed wiring boards with improved thermal properties.
In one embodiment, prepregs 124 include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs 124 have substrate materials that include carbon. In other embodiments, the prepregs 124 include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates 120 and 122 that can act as ground and/or power planes.
Inventors:
VASOYA KALU K
MANGROLIA BHARAT M
DAVIS WILLIAM E
BOHNER RICHARD A
MANGROLIA BHARAT M
DAVIS WILLIAM E
BOHNER RICHARD A
Application Number:
JP2008297101A
Publication Date:
July 23, 2009
Filing Date:
November 20, 2008
Export Citation:
Assignee:
CORE TECHNOLOGIES INC C
International Classes:
C08J5/24; H05K3/46; B32B5/26; B32B7/02; B32B27/04; B32B27/18; C08K3/38; C08K9/08; D03D15/275; H05K1/02; H05K1/03; H05K3/42; H05K3/44
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
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