Title:
LIQUID, CURABLE COMPOSITION
Document Type and Number:
Japanese Patent JP3454095
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain the subject composition, prevented from dripping and capable of giving the cured composition excellent in resistance to heat, medicines and solvents.
SOLUTION: This composition is obtained by including (A) a perfluoro compound having at least 2 alkenyl groups in the molecule, divalent perfluoroalkylene or perfluoropolyether structure in the main chain, and viscosity of 25 to 1,000,000 cp at 25°C, (B) an organosilicon compound having at least 2 hydrosilyl(SiH) groups in the molecule at 0.5 to 5 mols of the hydrosilyl group per mol of the alkenyl group in the component A, (C) a catalyst of platinum group metal in an effective quantity required for sililation of the components A and B, (D) a polyoxyalkylene compound having a molecular weight of 100 to 100,000 at 0.01 to 10 pts.wt. per 100 pts.wt. of the component A, and (E) a filler at 2 to 20 pts.wt. per 100 pts.wt. of the component A.
Inventors:
Takashi Matsuda
Shinichi Sato
Shinichi Sato
Application Number:
JP20385497A
Publication Date:
October 06, 2003
Filing Date:
July 14, 1997
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08L83/05; C08L83/07; (IPC1-7): C08L83/05; C08L83/07
Domestic Patent References:
| JP56853A | ||||
| JP8199070A | ||||
| JP8325998A | ||||
| JP61920A |
Attorney, Agent or Firm:
Takashi Kojima (1 person outside)