To provide a liquid epoxy resin composition high in adhesiveness, low in ion content, and excellent in storage stability, suitable for use especially as a flip chip packaging material or a substrate bonding material.
The liquid epoxy resin composition mainly comprises an epoxy resin (A) which is composed of an epoxy resin (A1) described by formula (1) and another epoxy resin (A2) with two or more glycidyl ether groups in a molecule, and is liquid at room temperature; one or more hardening agents (B) selected from the group consisting of hardeners and hardening catalysts; and a solvent (C) in the amount of 0.1-5 wt.%. The epoxy resin (A1) accounts for 5-75 wt.% of the liquid epoxy resin (A). In formula (1), one or more of R1-R5 are groups described by formula (2), and the others are 1-6C hydrocarbon groups or hydrogen atoms.
ICHIDA TAKESHI
TAKAHASHI HIROYUKI
ANZAI MASARU
| JP2004083711A | 2004-03-18 | |||
| JPH051265A | 1993-01-08 | |||
| JPH0453821A | 1992-02-21 | |||
| JP2003138100A | 2003-05-14 | |||
| JPH10195402A | 1998-07-28 | |||
| JPH11265960A | 1999-09-28 | |||
| JP2000327884A | 2000-11-28 | |||
| JP2003212964A | 2003-07-30 |
Tomohiro Nakamura
Eiichi Sano