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Title:
LOW-PERMITTIVITY COMPOSITE MATERIAL
Document Type and Number:
Japanese Patent JPH01225645
Kind Code:
A
Abstract:

PURPOSE: To obtain the title composite material having a desired permittivity, excellent heat resistance, chemical resistance, nonbrittleness and flexibility and suited for an insulation material etc., by adding a ground heat-meltable fluorocarbon resin foam to a polymeric material.

CONSTITUTION: A given amount of heat-meltable fluorocarbon resin particles in the form of hollow particles containing air in their insides, formed by mechanically grinding a foam of a heat-meltable fluorocarbon resin such as a tetrafluoroethylene/perfluoroalkyl vinyl ether of an expansion ratio of, e.g., about 60%, are added to a polymeric material such as a tetrafluoroethylene resin.


Inventors:
HOSHIKO TAKESHI
Application Number:
JP5224388A
Publication Date:
September 08, 1989
Filing Date:
March 04, 1988
Export Citation:
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Assignee:
JUNKOSHA CO LTD
International Classes:
C08J9/06; C08J9/32; C08J9/22; C08L27/18; H01B3/44; (IPC1-7): C08J9/22; C08J9/36
Domestic Patent References:
JPS5313229A1978-02-06