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Patent Searching and Data


Title:
LOW-VIBRATION TYPE SAW BLADE
Document Type and Number:
Japanese Patent JP2012245607
Kind Code:
A
Abstract:

To provide a low-vibration type saw blade for grinding or cutting a material to be ground which consists of a hard brittle material such as a stone, in particular, a super-hard brittle material such as a tile.

In the low-vibration type saw blade, a super-abrasive grain layer consisting of diamond abrasive grains or CBN abrasive grains is formed on an outer circumferential edge of a circular steel substrate. In a pair of male and female flanges formed of fiber reinforced plastic as a material, a mounting hole for an electric tool spindle is formed at the center portions. The pair of male and female flanges are integrally attached to a substantially 1/2 portion of the steel substrate in its outer circumferential direction via a center hole formed at the center of the steel substrate, so as to be held from both sides of the substrate.


Inventors:
SUMIDA NORIHISA
SUGIURA KAZUYA
Application Number:
JP2011129587A
Publication Date:
December 13, 2012
Filing Date:
May 25, 2011
Export Citation:
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Assignee:
SANKYO DIAMOND IND CO LTD
International Classes:
B24B45/00; B24D5/00; B24D5/12; B24D5/16; B28D1/04