Title:
ＭＣＰアセンブリおよび荷電粒子検出器
Document Type and Number:
Japanese Patent JP7021012
Kind Code:
B2
Abstract:
The MCP assembly of this embodiment is formed at least of a conductive upper support member, an MCP unit, an output electrode, a flexible sheet electrode, and a conductive lower support member as a structure for improving handleability of a flexible sheet electrode having a mesh area. The flexible sheet electrode includes the mesh area provided with plural openings. The flexible sheet electrode and the lower support member are physically and electrically connected to each other, and the flexible sheet electrode is sandwiched between the upper support member and the lower support member. As a result, even if the flexible sheet electrode becomes thin as an opening ratio of the mesh area increases, potential is set while the flexible sheet electrode is firmly held in the MCP assembly.
Inventors:
Masahiro Hayashi
Application Number:
JP2018118991A
Publication Date:
February 16, 2022
Filing Date:
June 22, 2018
Export Citation:
Assignee:
Hamamatsu Photonics Co., Ltd.
International Classes:
H01J43/28; H01J43/24; H01J43/30
Domestic Patent References:
| JP201737782A | ||||
| JP201478388A | ||||
| JP57196466A | ||||
| JP2011119279A | ||||
| JP2005538346A | ||||
| JP2006185828A | ||||
| JP200757432A |
Foreign References:
| US20080290267 | ||||
| US20050258356 | ||||
| US7564043 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Kenichi Shibayama
Yoshiki Kuroki
Kenichi Shibayama