Title:
MEMS JETTING STRUCTURE FOR DENSE PACKING
Document Type and Number:
Japanese Patent JP2023078404
Kind Code:
A
Abstract:
To enable more reduction of an area on a die available for an electric contact as a footprint of a liquid injection device becomes smaller.SOLUTION: A fluid ejector 100 comprises a substrate 122, and a fluid ejection module with a layer separate from the substrate. The substrate has a plurality of fluid ejection elements arranged in a matrix, each fluid ejection module is configured to cause fluid to be ejected from a nozzle 126. The layer separate from the substrate has a plurality of electrical connections, and each electrical connection is adjacent to the corresponding liquid injection element.SELECTED DRAWING: Figure 2
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Inventors:
BIBL ANDREAS
ESSEN KEVIN VON
HOISINGTON PAUL A
ESSEN KEVIN VON
HOISINGTON PAUL A
Application Number:
JP2023047956A
Publication Date:
June 06, 2023
Filing Date:
March 24, 2023
Export Citation:
Assignee:
FUJIFILM DIMATIX INC
International Classes:
B41J2/14
Attorney, Agent or Firm:
Masafumi Yanagida
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