PURPOSE: To improve packing density and reduce the electric resistance of an interlayer conductor path or to prevent corrosion of it, through the blocking penetration of chemical solvent, etc., in post-process, by liquid-phase-baking conductive powder for improving packing density of it, in manufacture of a multilayer ceramic circuit board used far electronic equipments such as a computer, etc.

CONSTITUTION: In the manufacturing method of a ceramic circuit board in which a via hole 2 is opened on a green sheet 1, formed by adding ceramic powder with a plastic agent, solvent, etc., and after that, the via hole 2 is packed with conductive powder, for baking, the conductive powder to be packed into the via hole 2 is mixed with at least one kind of metal powder which melts during baking, and thus obtained conductive powder 3 is liquid-phase- baked. However, at least a part of the metal powder that melts during baking can be replaced with alloy powder or glass powder.