Title:
MANUFACTURE OF HEAT-RESISTANT AG-PLATED CU-BASE SUBSTRATE
Document Type and Number:
Japanese Patent JPS60228695
Kind Code:
A
Abstract:
PURPOSE:To improve the adhesion of Ag plating and to reduce the thickness of the plating required when a Cu-base substrate is plated with Ag after forming a layer of Ni, Co or an alloy thereof by plating, by coating the substrate with Ag contg. Cu by striking before the substrate is plated with Ag. CONSTITUTION:The Cu or Cu alloy substrate is plated with Ni, Co or an alloy thereof, coated with Ag contg. Cu by striking, and plated with Ag. By the striking, the crystals of the resulting AG striking plating are made fine, and the adhesion of the Ag plating during the treatment of the Ag-plated Cu-base substrate at a high temp. can be improved. By this method the Ag-plated Cu-base substrate of high quality fit for treatment at a high temp. is obtd. only by changing the composition of a conventional Ag striking bath, and the thickness of the Ag plating required can be reduced as compared with a conventional method.
Inventors:
SHIGA SHIYOUJI
TACHIHARA KAZUO
UMEMIYA YOSHINOBU
TACHIHARA KAZUO
UMEMIYA YOSHINOBU
Application Number:
JP8464084A
Publication Date:
November 13, 1985
Filing Date:
April 26, 1984
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD
International Classes:
C25D5/10; (IPC1-7): C25D5/10
Domestic Patent References:
| JPS4884743A | 1973-11-10 |
Attorney, Agent or Firm:
Kiyoshi Minoura
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