Title:
PLATING METHOD OF FINE PATTERN
Document Type and Number:
Japanese Patent JPS60228694
Kind Code:
A
Abstract:
PURPOSE:To prevent the edge part of fine patterns from thickening by forming the pattern for preventing concentration of an electric field to the part near the top end of the fine pattern to be plated, supplying an electric power to both patterns and performing plating. CONSTITUTION:The respective one ends of plural heating elements 2 arranged and formed on a substrate 1 surface for, for example, a thermal head of an edge type are commonly connected to driving electrodes 3 and the other ends to a common electrode 4. A pattern 10 for preventing concentration of an electric field is formed integrally with the electrode 4 near the top ends of the electrodes 3 and is extended along the arrangement of the electrodes 3. Part of the electrode 4 of the thermal head subjected up to the stage for forming a rotective film is sandwiched by plating jigs connected to the power source and plating is executed with the thermal head as a cathode. The power source is conducted through the electrodes 4, the electrode 4 and the elements 2 to the pattern 10 and the electrodes 3, by which the plating is executed. The electric fields is not concentrated in the edge part at the top end of the electrodes 3 owing to the presence of the pattern 10 and the plating progresses according to the pattern.
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Inventors:
ABE HIDEO
YAMAGUCHI TAKAYUKI
YAMAGUCHI TAKAYUKI
Application Number:
JP8356484A
Publication Date:
November 13, 1985
Filing Date:
April 25, 1984
Export Citation:
Assignee:
RICOH KK
International Classes:
H05K3/18; B41J2/335; C25D5/02; H05K3/24; (IPC1-7): B41J3/20; C25D5/02; H05K3/18
Domestic Patent References:
| JP56143275B |
Attorney, Agent or Firm:
Shigeo Noguchi
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